Two technicians inspect HTE copper foil at Jinchuan Group Copper and Precious Metals Co's copper foil plant. [Photo/WeChat account: jinchuanjituan]
Jinchuan Group Copper and Precious Metals Co's copper foil plant has achieved stable mass production of high-quality HTE copper foil (high temperature elongation electrodeposited copper foil) with a thickness of just 8.5 micrometres (μm).
This technological breakthrough fills Jinchuan's gap in the ultra-thin copper foil segment below 10 μm, demonstrating that its HTE copper foil production technology has reached a leading level in China and laying a solid foundation for expansion into the high-end electronic circuit market.
HTE copper foil serves as an essential material for high-end electronic products such as high-frequency communication equipment and integrated circuit packaging substrates. To overcome technical bottlenecks, Jinchuan established a dedicated R&D team that started with fundamental processes, continuously improving core deposition technology to enhance the uniformity of the copper foil's microstructure. At the same time, they optimized surface treatment processes to strengthen bonding forces, ultimately achieving performance indicators that far exceed industry standards and meet high-end application requirements.
After resolving core performance issues, the team tackled mass production challenges such as the tendency of ultra-thin copper foil to tear or break. They achieved high-precision control of roller pressure, optimized additive formulations, and significantly reduced the incidence of foil breakage.
This successful mass production represents an important milestone in Jinchuan's efforts to overcome challenges in the high-end electronic copper foil sector. Moving forward, Jinchuan Group Copper and Precious Metals will continue focusing on the R&D and industrial application of high-performance electronic copper foil, striving for greater breakthroughs in the high-end electronic materials field.
