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Jinchuan making progress in high-end material manufacturing

Updated : May 16, 2025

In the production workshop of the Semiconductor Packaging Materials Division of Jinchuan Niedu Industrial Company, the fully automated forging production line operates at a speed of 1,000 times per minute, producing uniquely shaped copper strips with a thickness of just 0.38 millimeters.

These copper strips will serve as the core material for integrated circuit lead frames, supporting the structure of chip packaging.

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Jinchaun's copper strips

With the rapid growth of new energy vehicles, 5G communication, and the integrated circuit industry, lead frames face the challenge of being light, thin, strong, and conductive. In order to meet the demand for high-end copper strips for lead frames, Jinchuan has upgraded its technology, transitioning from the mid-low end to the high end. Through improvements in forging technology and alloy ratios, the company has successfully manufactured high-quality uniquely shaped copper strips that meet the stringent material performance requirements of integrated circuit packaging.

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Two workers at the copper strips production line in Jinchuan

Jinchuan has achieved precision production of high-end uniquely shaped copper strips through the "technological revolution" of forging and rolling, increasing the conductivity to 90%. Its automation equipment and intelligent control systems have enhanced production efficiency and product quality. Additionally, its independently developed high-frequency, large-tonnage forging equipment meets the high requirements of integrated circuit packaging, breaking foreign technological monopoly and injecting new vitality into the Chinese semiconductor industry.

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Jinchaun's copper strips

By establishing a complete semiconductor industry chain, including high-end lead frame projects and new material production line projects, Jinchuan has formed a semiconductor industry corridor with resource advantages, technological innovation, and large-scale production. Jinchuan, along with its partners, has overcome challenges, driving the development of the Chinese semiconductor industry, achieving independent innovation, and demonstrating leading capabilities.

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