Jinchuan copper has undergone a transformation from its raw state to a refined material, achieving deep refinement in high-temperature furnaces and ultimately showcasing its unique value across various industries. Recently, the Semiconductor Packaging Materials Division of Jinchuan Niudu Industrial Company has been operating two 120-ton integrated forging production lines at full capacity. These lines transform finger-thick copper wires into rose-gold "shaped copper strips" used for mobile phone chip installation. Manager Liu Dong explained that the production line has a forging frequency of 1000 times per minute and a production speed of 7 meters per minute, with dimensional precision controlled within 0.015 millimeters, reaching advanced domestic technical standards.
The "shaped copper strips"
The "shaped copper strips" are primarily used for semiconductor lead frames, requiring high heat resistance, corrosion resistance, electrical conductivity, and thermal conductivity. As integrated circuits evolve towards miniaturization, thinness, lightness, and multifunctionality, high-strength and high-conductivity lead frame materials are becoming the market standard. The company has successfully developed core integrated forging production equipment on the basis of their existing rolled "shaped copper strip" production line and pioneered the dual-process integration of forging and rolling in China, achieving one-time forming and significantly enhancing product quality and precision. Zhao Yanmin, project manager of the Technical Quality Department, stated that they have addressed fundamental issues in multiple research projects, promoting the mass production of forged alloy copper strips and nickel-based high-temperature alloy products.
The "shaped copper strips"
Leveraging high-quality and abundant cathode copper resources, Niudu Industrial Company has successfully developed core integrated forging production equipment and has become the first in China to adopt the dual-process integration of forging and rolling for producing high-end shaped copper strips used in semiconductor packaging. This has significantly improved product quality and precision. In recent years, the company has accelerated its industrial structure upgrade, continuously deepening its focus on non-ferrous metal deep processing and having achieved remarkable results. Last year, the company succeeded in improving both quality annd quantity of its products such as phosphor bronze electroplating anode materials, high-precision copper plates and strips, shaped copper strips, and tin anode materials.
